【英文标准名称】:Printedboardsandassemblies-Designanduse-Attachment(land/joint)considerations-ChipcarrierswithJ-leadsonfoursides
【原文标准名称】:印制板和组件.设计和使用.附件条件.四面带有J形引线的片状载体
【标准号】:BSEN61188-5-6-2003
【标准状态】:现行
【国别】:英国
【发布日期】:2003-06-26
【实施或试行日期】:2003-06-26
【发布单位】:英国标准学会(BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:电子工程;规范(验收);显影;开关电路;连接;电子设备;架设(施工作业);设备;应用;表面安装设备;集成电路;电路;印制电路板;表面安装;结构体系;组装件;辅助框架;电路工艺;制造;电气工程;J形;开关速度;附件;电子设备及元件;设计;片状载体;元部件
【英文主题词】:Applications;Assemblies;Attachments;Chipcarrier;Circuitengineering;Circuits;Components;Connections;Design;Developments;Electricalengineering;Electronicengineering;Electronicequipment;Electronicequipmentandcomponents;Equipment;Erecting(constructionoperation);Integratedcircuits;J-shape;Manufacturing;Printed-circuitboards;SMD;Specification(approval);Structuralsystems;Subracks;Surfacemounting;Switchingcircuits;Switchingspeed;Use
【摘要】:ThispartofIEC61188providesinformationonlandpatterngeometriesusedforthesurfaceattachmentofelectroniccomponentswithJleadsonfoursides.Theobjectofthisstandardistoprovidetheappropriatesize,shapeandtolerancesofsurfacemountlandpatternssoastoensuresufficientareafortheappropriatesolderfillet,andalsoallowforinspection,testingandreworkingofresultingsolderjoints.Eachclausecontainsaspecificsetofcriteria,settingoutdetailsonthecomponent,thecomponentdimensions,thesolderjointdesignandthelandpatterndimensions.NOTETheacronymQFJisthenamingconventionusedbyJapan;theacronymPLCCisthenamingconventionusedbytheUSAforthesecomponents.
【中国标准分类号】:L30
【国际标准分类号】:31_190
【页数】:22P.;A4
【正文语种】:英语